Technology Background
Precision Low-Power Robust

Push Silicon to the Limit

Leverage the world's most advanced and proven silicon process technology to push silicon to its absolute limits, enabling breakthroughs in more value-added applications. Our company focuses on high performance chip for photonics, smart sensoring, power management with low Silicon cost solutions. We cooperates with leading foundry partners, bridging with Si-photonics, CMOS-MEMS to provide highly-integrated, high performance, low-power, system-level solutions.

0+ Products
0+ Global Clients
0+ Years Experience
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Extreme Power Efficiency

Ultra-low leakage, low energy data conversion, battery-less operation for extreme applications.

Extreme Temperature

Ultra-low/high temperature operation from -40°C to 175°C for harsh environments.

Edge Computing

Energy-efficient edge computing with systematic DFE optimization and low-power wireless communication.

High Reliability

Industrial & automotive-grade quality with ESD/EMI protection and AEC-Q100 qualification support.

It focuses on the cutting-edge development of optical interconnection and optical communication, while promoting the coordinated development of multi-category chips.

Optical Communication
Featured

Optical Communication

High-performance, high-sensitivity and low-power optical solutions for optical imaging, optical interconnection and optical computing scenarios.

  • Optical image sensors (including CMOS image sensors, SPAD sensors)
  • Silicon photonics chips for optical interconnection & optical computing solutions
  • High-precision optical sensing chips with high signal-to-noise ratio (SNR) and anti-optical interference
  • High-sensitivity optical detection chips & optical signal conditioning
  • Optical module driver chips for high-speed optical communication
Machine vision& Laser ranging Optical communication Optical computing Consumer electronics

Star Products:

Multi-mode Fiber Transceiver Module
  • 5 Mbps Fiber Optic Transceiver Module
    Transceiver Link Parameters
    Part No. Data Rate Fiber Length Supply Voltage Propagation Delay LOW to HIGH Propagation Delay HIGH to LOW
    NRS1412/NRS2412 DC-5 MBd 3.9 km 5 V 53 ns 45 ns
    NRS1414/NRS2412 DC-5 MBd 5 km 5 V 56 ns 40 ns
    Transmitter Performance Parameters
    Part No. Operating Temperature Peak Emission Wavelength Forward Voltage Output Power (62.5/125μm Fiber Cable) Output Power (100/140μm Fiber Cable)
    NRS1412 -40 ~ 85 ℃ 850 nm 1.49 V -16.5 dBm -12 dBm
    NRS1414 -40 ~ 85 ℃ 850 nm 1.49 V -13.5 dBm -7 dBm
    Receiver Performance Parameters
    Part No. Data Rate Operating Temperature High Level Supply Current Low Level Supply Current Peak Optical Input Power (Logic Level LOW)
    NRS2412 DC-5 MBd -40 ~ 85 ℃ 5.3 mA 5.5 mA -29 dB
  • 10 Mbps Fiber Optic Transceiver Module
    Transceiver Link Parameters
    Part No. Data Rate Fiber Length Supply Voltage Propagation Delay LOW to HIGH Propagation Delay HIGH to LOW
    NRS1414/NRS2417 DC-10 MBd 5 km 5 V 50 ns 33 ns
    Transmitter Performance Parameters
    Part No. Operating Temperature Peak Emission Wavelength Forward Voltage Output Power (62.5/125μm Fiber Cable) Output Power (100/140μm Fiber Cable)
    NRS1414 -40 ~ 85 ℃ 850 nm 1.49 V -13.5 dBm -7 dBm
    Receiver Performance Parameters
    Part No. Data Rate Operating Temperature High Level Supply Current Timing Parameter (as provided) Peak Optical Input Power (Logic Level LOW)
    NRS2417 DC-10 MBd -40 ~ 85 ℃ 5.0 mA ±20 ns -29 dB
Laser Ranging Chip
  • Photodetector
    Part No. Response Wavelength Peak Response Wavelength Responsivity(λ=905nm Pin=1μW M=100) Dark Current(M=100) Capacitance(M=100 f=1MHz)
    NRL32301 400-1100nm 905nm 50A/W 0.8nA 1.0pF
    NRL35501 400-1100nm 905nm 50A/W 1nA 1.2pF
    NRL38001 400-1100nm 905nm 50A/W 1.2nA 2.0pF
  • Trans-Impedance Amplifier
    Part No. Package Supply Voltage Supply Current transimpedance 3dB Bandwidth Slew Rate HD2 HD3
    NRL9919 QFN16 2.7~3.6V 23.5mA 20kΩ 125MHz 215V/μs -80dBc -82dBc
Optical module
  • SFP Optical Module
  • 1x9 Optical Module
  • Multi-function Transceiver
Ultra low power Sensors

Energy-efficient Sensors

High-accuracy, ultra-low leakage, CMOS-MEMS compatible sensor solutions.

  • High integration density with on-chip amplification, filtering, and analog-to-digital conversion
  • Superior signal-to-noise ratio (SNR) and reduced parasitic interference
  • Ultra Low power consumption ideal for battery-operated systems
  • CMOS-MEMS within the same chip
  • High manufacturability, scalability, and cost efficiency in volume production

Optical Communication Chip

Core functions are high-speed photoelectric signal conversion and communication processing.

Star Products:
ASPT-YY-TO-TIA000AXA

155 Mbps PIN-TIA TO-CAN integrates 2.5 Gbps InGaAs PIN (positive-intrinsic negative) photodiodes and 155M~350Mbps high sensitivity transimpedance amplifier. The TIA with AGC and dynamic range of - 40~+3dBm provides a low-cost optical transmission system solution.

ASPT-STIA02A

The 2.5 Gbps InGaAs PIN (positive-intrinsic-negative) plus Pres-amplifier integrates a 2.5G PIN photodiodeand a high sensitivity transimpedance amplifier FOC0250. It employs automatic offset, gain, and bandwidth control functions, which allows stable bandwidth and output swing for over 34 dB input signal range. The 2.5 Gbps InGaAs PIN (positive-intrinsic-negative) plus Pres-amplifier is suitable for GPON ONU application.

ASPT-STIA01B

The 2.5 Gbps InGaAs PIN (positive-intrinsic-negative) plus Pres-amplifier integrates a 2.5G PIN photodiode and a high sensitivity transimpedance amplifier EOC1089. It employs automatic offset, gain, and bandwidth control functions, which allows stable bandwidth and output swing for over 34 dB input signal range. The 2.5 Gbps InGaAs PIN (positive-intrinsic-negative) plus Pres-amplifier is suitable for GPON ONU application.

Power Driver ICs

Power Driver ICs

high-efficiency, low-RDS(ON) switching performance for motor control and power conversion applications

  • Low On-Resistance: RDS(ON) as low as 200mΩ (HS+LS) for minimal conduction loss
  • High Current Capability: Up to 6A peak, 4A continuous (H-bridge)
  • Wide Voltage Support: 2.7V–45V (motor drivers), 600V (high-voltage gate drivers)
  • Flexible Interfaces: 3.3V/5V/15V logic compatible, PWM/STEP/DIR control
  • Thermally Optimized Packages: ESOP8, TSSOP20, QFN20 for high power density
  • Industrial and AEC-Q100 automotive-grade specifications
Industrial drives power modules automotive motors LED lighting power tools

Stepper Motor Driver Portfolio

Part No. Interface Channels Voltage Micro-Step Current Package
AS4985 STEP/DIR 2 8.0~32V 1~1/8 1.0A QFN24
AS4988 STEP/DIR 2 8.0~32V 1~1/16 2.0A QFN28
AS8825 STEP/DIR 2 8.0~32V 1~1/32 2.5A ETSSOP28
AS8842 STEP/DIR 2 8.0~40V 1~1/32 2.5A ETSSOP28
AS5833 STEP/DIR 2 4.75~28V 1~1/256 2.5A QFN28
AS3988 PHS/EN 4 8.0~32V 1~1/4 1.2A QFN36
AS8833 PWM 2 2.7~12V 1.5A ETSSOP16/QFN16
... ... ... ... ... ... ...
High-Precision Lower Power Analog IC

High-Precision Lower Power Analog IC

High-precision perception, signal acquisition and intelligent processing solutions for various scenarios.

  • High-precision analog-to-digital conversion/digital-to-analog conversion (ADC/DAC) perception chips
  • Image sensors & high-precision visual perception ADCs
  • High-precision environmental perception (temperature/humidity/air pressure) chips
Applications Background

Target Markets & Applications

Our chips power a wide range of industries, from industrial automation to smart consumer devices.

Solutions Overview

Industrial Control & Automation

Precision sensor interfaces and robust driver ICs for factory automation, process control, and robotics.

Automotive Electronics

AEC-Q100 qualified chips for body electronics, sensing systems, and power management modules.

Smart Sensing & IoT

Ultra-low-power sensor nodes and wireless communication ICs for IoT and smart sensing applications.

Consumer Electronics & Smart Home

Cost-effective, compact chip solutions for home appliances, wearables, and smart home devices.

Medical & Measurement

High-precision analog front-ends and signal conditioning ICs for medical instruments and measurement equipment.

Power Supply & Driver Modules

High-voltage, high-current driver ICs and power management solutions for industrial power systems.

Core values

Deep expertise in analog & mixed-signal design, delivering differentiated value to our partners.

01

Professional Analog & Mixed-Signal Design

Deep experience in high-precision, low-noise, high-reliability analog IC design with proven track record.

02

Full Product Line

Sensor interfaces, mixed-signal chips, driver ICs — covering industrial, automotive, consumer, and IoT markets.

03

High Reliability & Stability

Strict quality control system supporting industrial and automotive-grade requirements with full qualification.

04

Flexible Customization

Strong capability in customized chip design with rapid solution iteration for unique customer needs.

05

Stable Supply & Technical Support

Professional FAE & technical team supporting mass production and system-level optimization worldwide.

06

Professional Team

Core team from top global universities with advanced degrees; 10+ years’ experience in analog/mixed-signal chips, full-process expertise from design to mass production.

About Background

Awesome Semi Pte. Ltd.

The company focuses on high-performance optical chips, providing quality solutions. It cooperates with leading wafer foundry partners, focuses on optical interconnection/communication, balances multi-category chips and covers SOI/Gesi, signal chain and BCD.

Singapore HQ Global Operations
Quality Certified Industrial & Automotive Grade
Full-Stack Capability Design to Mass Production

Contact Us

Ready to explore how our chip solutions can power your next project? Reach out to our team.

Email

info@asmsemi.com

Website

www.asmsemi.com

Location

1 Fusionopolis Way, #05-10, Connexis, Singapore 138632
Singapore